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Detection of Wafer Defects

Metrology and wafer defect detection are vital in semiconductor manufacturing , providing the means to monitor and control the quality of each step in the manufacturing sequence.

Wafers defect's inspection
DESCRIPTION

For microscopy purposes, 2D chromatic confocal line cameras are also available. For applications where very high resolution and a large depth of focus are required, these provide a perfect focus on the Z-axis. That's what makes them the right solution for inspecting  defects, for example on the wafer edge and during the packaging process. All these types of sensors can be integrated inside metrology and inspection machines. The decades of experience of Marposs and STIL are available for a customized solution and dedicated optical design.

BENEFITS
  • Minimum lateral resolution of 0.4μm * 0.4μm
  • High Slope Angle: +/-45° with NA of 0.75
  • Up to 199.5 klines per second
  • Extended depth of field (of perfect focus)
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BROCHURES AND MANUALS

Brochure Data Sheet
English SEMICONDUCTORS: (2.27MB)
STIL - General Catalogue: (13.23MB)
Italian SEMICONDUCTORS: (2.63MB)
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German SEMICONDUCTORS: (2.28MB)
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Russian SEMICONDUCTORS: (2.23MB)
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Japanese SEMICONDUCTORS: (2.38MB)
STIL - General Catalogue: (21.22MB)
Korean SEMICONDUCTORS: (7.41MB)
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Simplified Chinese SEMICONDUCTORS: (5.06MB)
STIL - General Catalogue: (18.78MB)
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