SEMICONDUCTOR INDUSTRY
Solutions for Semiconductor
and Led Process
Discover our applications dedicated to
Semiconductor and LED industry
Marposs provides different kind of sensors that can improve the machine reliability and help in assuring a constant and high quality production. These sensors have been designed to properly work inside a machine and thanks to dedicated signal elaboration immediately detect events or changes in the machine environment. Here are some specific used of Marposs solutions.
During the ingot slicing process, it is important to stop immediately the machine in case the diamond wire brakes. Marposs acoustic sensor can detect the wire breakage and immediately stop the machine.
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This process is particularly critic and a strict control of wafer total thickness variation is also required. Thanks to Marposs infrared sensor it is possible to control the thickness during and soon after this important operation.
Wafer thinning is always a delicate process. Chips are already present on the wafer and any fail in the process affects the production yield and costs. Tight control on the thinning in-process operation is possible using contact or non-contact gauges, even in presence of DI water.
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Without an effective monitoring system, production can be seriously affected: from blade wear leading to significant scrap, to potential damage to wafers. The dicing process involves several fundamental aspects from the point of view of the sensor monitoring the blade.
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Marposs and STIL sensors cover a wide range of applications starting from thickness, TTV, bow, warp measure tiil a complete 2D image and 3D topoghrapy
Chromatic Confocal technology is the optimized solution to produce different types of high-accuracy measurements. The optical pens offer different working distance, measurement range, spot size on the target as well as numerical aperture of the light beam. Interferometric (IR and white light) products are also available to detect the thickness of transparent and non-transparent materials performing a very accurate measure.
To obtain 3D images, different type of line sensors are available. Coaxial acquisition on a defined line length is performed at high frequency rate.
For microscopy purposes, 2D chromatic confocal line cameras are also available for applications where very high-resolution and extended depth of field are required, obtain a perfect focus on Z-axis. In order to get acquisition on a square area a scan system is required.
