DESCRIPTION
Achieving the correct wafer thickness before assembly is a key factor in semiconductor manufacturing. Wafer back grinding (or wafer thinning) is a semiconductor manufacturing process designed to control the wafer thickness, essential to produce ultra-thin wafers used to create stacked and high-density packaging in compact electronic devices.
Wafer thinning is always a critical process. The chips are already on the wafer and any failure in the process affects production yield and costs. Tight in-line control on the thinning in-process operation is possible using contact gauges or non-contact sensors, even in the presence of DI water.
Using Marposs sensors is even possible to detect the very moment the grinding wheel touch the wafer or check any power overload.
BENEFITS
- In-process reliable thickness measure in a dry and wet environment
- Measure not influenced by tape support or glue presence
- From 4 to 900µm absolute thickness control (one side measure)
- Smart thickness elaboration for a smooth control till very thin thickness and data-log (black box function)
