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MARPOSS FOR THE SEMICONDUCTOR INDUSTRY: A solution provider for your measuring tasks

The semiconductor industry is one of the most vibrant sectors. It is no exaggeration to say that the evolution of semiconductor technology has supported the evolution of mankind

Semiconductors are mainly applied in electric vehicles, data centers, smartphones, and factory automation equipment.

This is an area that Marposs has focused on in the past, and now more than ever.

The semiconductor market is increasingly improving in sensorizing and taking control of each process. Metrology and wafer defects detection is vital in semiconductor manufacturing, providing the means to monitor and control the quality of each step in the manufacturing sequence. For example, in the dicing process, axes are controlled to ensure the highest precision in wafer processing.

In the die-clamping process, placing the chip in the correct position is very important. Furthermore, in the back grinding process, sensors are important to measure the thickness of the wafer in real-time.

The importance of back grinding machines

At first, the thickness of the wafer was given by ease of handling. This was to prevent the wafer from cracking during transportation. However, as technology evolves, the wafer eventually needs to be ground thinner, to achieve a smaller size and higher performance.

The thinner the wafer, the more it can be stacked, enabling higher performance and smaller semiconductor packages.

Therefore, the role of back-grinding machines is very important in the evolution of semiconductors. However, if a wafer is ground thin without any control, it will break due to the load of the wheel or scratches during the thinning operation.

Hence, it is important to design appropriate machining conditions, choose the right grinding wheel and measure the wafer thickness in real-time.

Marposs solutions for back grinding process control

Marposs has a long history of trust and achievement in the field of measurement. We can leverage this strength to offer a variety of solutions, such as Unimar-series contact gauges, chromatic confocal sensors, and interferometric sensors as non-contact gauges.

Although there are differences in price and performance, all can measure thickness in real time and meet customers' needs. It is possible to measure materials that include silicon, sapphire, GaAs, and power semiconductor materials such as SiC and GaN.

Contact gauge and confocal sensors use the chuck table surface as a reference unit and can measure the thickness of the wafer surface by contact or non-contact.
Interferometric sensors can measure the actual thickness of the wafer substrate regardless of the presence of other layers.

Our controllers can also manage a mix of sensors, force, power, fluid, and accelerometers. They can be integrated within a machine to optimize the process and keep the machine under control throughout its working lifetime.

Do you have a measurement problem in product development or at a mass production site? We are your answer! 

Discover our solutions for Back-Grinding 

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